From schematic capture and high-speed PCB design to rapid multi-layer fabrication, firmware bring-up, and direct-to-bench component delivery.
Verified Hardware DeliveryEngage our certified engineering teams for specific stages or full lifecycle hardware development.
1 to 16 layer rigid, flex, and metal-core PCB fabrication with SMT stenciling and automated pick-and-place assembly.
Custom schematic creation, controlled impedance stackups, high-speed differential pairs, and EMI/EMC compliance engineering.
FreeRTOS, Zephyr, and bare-metal firmware with hardware driver integration, BLE/Wi-Fi communication, and secure bootloaders.
Direct consultation with senior hardware architects to select optimal SoCs, evaluate supply chain availability, and derisk mass production.
A transparent, automated pipeline from specification to working hardware
Upload your schematic, netlist, or initial concept. Our engine performs immediate footprint verification against verified component stock.
Gerber and drill layers undergo automated clearance, thermal relief, and trace impedance checks to catch manufacturing defects before fab.
Precision FR4 or Rogers substrate drilling, copper plating, solder mask application, and ENIG/HASL surface finishing under ISO 9001 controls.
High-speed Yamaha/Panasonic pick-and-place lines populate passives, ICs, and BGAs down to 0201 metric sizes with reflow profile logging.
Automated Optical Inspection (AOI), X-ray BGA verification, voltage rail testing, and flash programming of verified bootloader firmware.
ESD vacuum packaging and real-time tracked courier dispatch via Shiprocket with milestone notification updates straight to your dashboard.
Genuine components in stock with guaranteed trace origin and immediate dispatch
